{"id":423067,"date":"2024-10-20T06:44:24","date_gmt":"2024-10-20T06:44:24","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bs-en-iec-62391-12022\/"},"modified":"2024-10-26T12:38:43","modified_gmt":"2024-10-26T12:38:43","slug":"bs-en-iec-62391-12022","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bs-en-iec-62391-12022\/","title":{"rendered":"BS EN IEC 62391-1:2022"},"content":{"rendered":"
IEC 62391-1:2022 applies to fixed electric double-layer capacitors (hereafter referred to as capacitors) mainly used in DC circuits of electric and electronic equipment. This part of IEC 62391 establishes standard terms, inspection procedures and methods of test for use in sectional and detail specifications of electronic components for quality assessment or any other purpose. This edition includes the following significant technical changes with respect to the previous edition: <\/p>\n
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2<\/td>\n | undefined <\/td>\n<\/tr>\n | ||||||
7<\/td>\n | Annex ZA (normative)Normative references to international publicationswith their corresponding European publications <\/td>\n<\/tr>\n | ||||||
10<\/td>\n | Blank Page <\/td>\n<\/tr>\n | ||||||
11<\/td>\n | English CONTENTS <\/td>\n<\/tr>\n | ||||||
16<\/td>\n | FOREWORD <\/td>\n<\/tr>\n | ||||||
18<\/td>\n | 1 Scope 2 Normative references <\/td>\n<\/tr>\n | ||||||
19<\/td>\n | 3 Terms and definitions <\/td>\n<\/tr>\n | ||||||
24<\/td>\n | 4 General requirements 4.1 Unit and symbols 4.2 Preferred values and class 4.2.1 General 4.2.2 Preferred values of nominal capacitance 4.2.3 Class 4.3 Marking 4.3.1 General 4.3.2 Coding <\/td>\n<\/tr>\n | ||||||
25<\/td>\n | 5 General provisions for tests and measurement procedures 5.1 General 5.2 Test and measurement requirements 5.2.1 Test conditions 5.2.2 Measurement conditions 5.2.3 Voltage treatment 5.2.4 Thermal treatment 5.3 Drying <\/td>\n<\/tr>\n | ||||||
26<\/td>\n | 5.4 Storage 5.4.1 Storage at high temperature 5.4.2 Storage at low temperature 6 Electrical tests and measurements 6.1 Measurement method 1 for capacitance and internal resistance (constant current discharge) 6.1.1 Basic circuit for measuring <\/td>\n<\/tr>\n | ||||||
27<\/td>\n | 6.1.2 Measuring equipment Figures Figure 1 \u2212 Basic circuit for measuring <\/td>\n<\/tr>\n | ||||||
28<\/td>\n | 6.1.3 Measurement procedure Figure 2 \u2013 Voltage\u2013time characteristics between capacitor terminalsin capacitance and internal resistance measurement <\/td>\n<\/tr>\n | ||||||
29<\/td>\n | Tables Table 1 \u2013 Measurement conditions for measurement method 1A <\/td>\n<\/tr>\n | ||||||
30<\/td>\n | 6.1.4 Calculation methods for capacitance Table 2 \u2013 Measurement conditions for measurement method 1B <\/td>\n<\/tr>\n | ||||||
31<\/td>\n | 6.1.5 Calculation methods for internal resistance <\/td>\n<\/tr>\n | ||||||
32<\/td>\n | 6.1.6 Conditions to be prescribed in the detail specification 6.2 Measurement method 2 for capacitance and internal resistance 6.2.1 Constant resistance charging method for capacitance measurement Figure 3 \u2212 Circuit for constant resistance charging method <\/td>\n<\/tr>\n | ||||||
33<\/td>\n | 6.2.2 AC internal resistance measurement method 6.3 Leakage current 6.3.1 Measurement method Figure 4 \u2212 Circuit for AC resistance method <\/td>\n<\/tr>\n | ||||||
34<\/td>\n | Figure 5 \u2013 Circuit for measuring leakage currents <\/td>\n<\/tr>\n | ||||||
35<\/td>\n | 6.3.2 Items to be specified in the detail specification 6.4 Maintain voltage 6.4.1 Measurement method Figure 6 \u2212 Diagram of current and voltage changes at the timeof measuring the leakage current <\/td>\n<\/tr>\n | ||||||
36<\/td>\n | 6.4.2 Calculation of voltage maintenance rate 6.4.3 Conditions to be stated in the detail specification 7 Mechanical tests and measurements 7.1 Visual examination and check of dimensions 7.1.1 Visual examination 7.1.2 Dimensions (gauging) Figure 7 \u2212 Maintain voltage test diagram <\/td>\n<\/tr>\n | ||||||
37<\/td>\n | 7.1.3 Dimensions (detail) 7.2 Robustness of terminations 7.2.1 Test Ua1 \u2013 Tensile 7.2.2 Test Ub \u2013 Bending (half of the sample) 7.2.3 Test Uc \u2013 Torsion (remaining sample) 7.2.4 Test Ud \u2013 Torque (for terminations with threaded studs or screws and for integral mounting devices) Table 3 \u2013 Tensile force <\/td>\n<\/tr>\n | ||||||
38<\/td>\n | 7.2.5 Visual examination 7.3 Vibration 7.3.1 Initial measurement 7.3.2 Test 7.3.3 Final measurement and requirements 8 Environmental and climatic tests 8.1 Rapid change of temperature 8.1.1 Initial measurement 8.1.2 Test 8.1.3 Final inspection, measurements and requirements Table 4 \u2013 Torque <\/td>\n<\/tr>\n | ||||||
39<\/td>\n | 8.2 Damp heat, steady state 8.2.1 Initial measurement 8.2.2 Test 8.2.3 Final measurement 8.3 Endurance 8.3.1 Initial measurements 8.3.2 Test 8.3.3 Final measurement, inspection and requirements <\/td>\n<\/tr>\n | ||||||
40<\/td>\n | 8.4 Characteristics at high and low temperature 8.4.1 General 8.4.2 Test procedure 8.4.3 Dry heat 8.4.4 Cold 8.4.5 Final measurement and requirements 9 Tests related to component assembly 9.1 Resistance to soldering heat 9.1.1 Preconditioning and initial measurement 9.1.2 Test <\/td>\n<\/tr>\n | ||||||
41<\/td>\n | 9.1.3 Recovery 9.1.4 Final inspection, measurements and requirements 9.2 Solderability 9.2.1 General 9.2.2 Preconditioning 9.2.3 Capacitors with leads <\/td>\n<\/tr>\n | ||||||
42<\/td>\n | 9.2.4 Surface mount capacitors 9.3 Component solvent resistance 9.3.1 Initial measurements 9.3.2 Test 9.3.3 Requirements <\/td>\n<\/tr>\n | ||||||
43<\/td>\n | 9.4 Solvent resistance of marking 9.4.1 Test 9.4.2 Requirements 10 Tests related to safety 10.1 Passive flammability 10.1.1 Test procedure 10.1.2 Requirements <\/td>\n<\/tr>\n | ||||||
44<\/td>\n | 10.2 Pressure relief (if applicable) 10.2.1 Test 10.2.2 Requirements 11 Quality assessment procedures Table 5 \u2013 Severities and requirements <\/td>\n<\/tr>\n | ||||||
45<\/td>\n | Annex A (normative)Classification according to capacitance and internal resistance A.1 General A.2 Classification by capacitance and internal resistance <\/td>\n<\/tr>\n | ||||||
46<\/td>\n | Figure A.1 \u2013 Conceptual rendering orientated by characteristics in each classification Table A.1 \u2013 Electrical performance and measurement method by class <\/td>\n<\/tr>\n | ||||||
47<\/td>\n | Annex B (informative)Measurement method of capacitance and low resistanceby low frequency AC method (reference) B.1 General B.2 Measurement system B.3 Calculation of capacitance Figure B.1 \u2013 Capacitance measurement system by the low frequency AC method <\/td>\n<\/tr>\n | ||||||
48<\/td>\n | B.4 Measurement conditions <\/td>\n<\/tr>\n | ||||||
49<\/td>\n | Annex C (informative)Thermal equilibrium time of capacitors C.1 General C.2 Thermal equilibrium time of capacitors Figure C.1 \u2013 Thermal equilibrium times of capacitors (from 85 \u00b0C to 25 \u00b0C) <\/td>\n<\/tr>\n | ||||||
50<\/td>\n | Figure C.2 \u2013 Thermal equilibrium times of capacitors (from \u221240 \u00b0C to 25 \u00b0C) Figure C.3 \u2013 Capacitor core temperature change with respect to time <\/td>\n<\/tr>\n | ||||||
51<\/td>\n | Annex D (informative)Charging\/discharging efficiency and measurement current D.1 General D.2 Charging efficiency, discharging efficiency, and current D.2.1 Calculation assuming full charge and discharge <\/td>\n<\/tr>\n | ||||||
52<\/td>\n | D.2.2 Calculation assuming incomplete charging and discharging due to internal resistance <\/td>\n<\/tr>\n | ||||||
55<\/td>\n | Annex E (informative)Procedures for setting the measurement current of capacitorwith uncertain nominal internal resistance E.1 General E.2 Current setting procedures for measurement of capacitor E.3 Example of a current setting procedure and parameters Table E.1 \u2013 Example of setting current for measurement of capacitor <\/td>\n<\/tr>\n | ||||||
56<\/td>\n | Annex F (informative)Policy on uncertainty of measurement and inset limits F.1 Objective F.2 Calculation of measurement uncertainty F.3 Policy F.4 Calculation of inset and outset limits <\/td>\n<\/tr>\n | ||||||
57<\/td>\n | F.5 Examples F.5.1 General F.5.2 Example 1: Resistor measurement F.5.3 Example 2: Resistor measurement F.5.4 Example 3: Transistor measurement (gain) F.5.5 Example 4: Comparison between initial and final measurement results <\/td>\n<\/tr>\n | ||||||
58<\/td>\n | Annex Q (normative)Quality assessment procedures Q.1 General Q.1.1 Overview Q.1.2 Applicability of qualification approval Q.1.3 Applicability of capability approval <\/td>\n<\/tr>\n | ||||||
59<\/td>\n | Q.1.4 Applicability of technology approval Q.2 Primary stage of manufacture Q.3 Subcontracting Q.4 Structurally similar components Q.5 Qualification approval procedures Q.5.1 Eligibility for qualification approval <\/td>\n<\/tr>\n | ||||||
60<\/td>\n | Q.5.2 Application for qualification approval Q.5.3 Test procedure for qualification approval Q.5.4 Granting of qualification approval Q.5.5 Maintenance of qualification approval Q.5.6 Quality conformance inspection Q.6 Capability approval procedures Q.6.1 General <\/td>\n<\/tr>\n | ||||||
61<\/td>\n | Q.6.2 Eligibility for capability approval Q.6.3 Application for capability approval Q.6.4 Description of capability Figure Q.1 \u2013 General scheme for capability approval <\/td>\n<\/tr>\n | ||||||
62<\/td>\n | Q.6.5 Demonstration and verification of capability Q.6.6 Programme for capability approval <\/td>\n<\/tr>\n | ||||||
63<\/td>\n | Q.6.7 Capability approval test report Q.6.8 Abstract of description of capability Q.6.9 Modifications likely to affect the capability approval Q.6.10 Initial capability approval <\/td>\n<\/tr>\n | ||||||
64<\/td>\n | Q.6.11 Granting of capability approval Q.6.12 Maintenance of capability approval <\/td>\n<\/tr>\n | ||||||
65<\/td>\n | Q.6.13 Extension of capability approval Q.6.14 Quality conformance inspection Q.7 Rework and repair Q.7.1 Rework <\/td>\n<\/tr>\n | ||||||
66<\/td>\n | Q.7.2 Repair Q.8 Release for delivery Q.8.1 General Q.8.2 Release for delivery under qualification approval before the completion of group B tests Q.9 Certified test records of released lots Q.10 Delayed delivery Q.11 Alternative test methods Q.12 Manufacture outside the geographical limits of IECQ CBs Q.13 Unchecked parameters <\/td>\n<\/tr>\n | ||||||
67<\/td>\n | Q.14 Technology approval procedures Q.14.1 General Q.14.2 Eligibility for technology approval Q.14.3 Application of technology approval Q.14.4 Description of technology Q.14.5 Demonstration and verification of the technology Q.14.6 Granting of technology approval Q.14.7 Maintenance of technology approval Q.14.8 Quality conformance inspection <\/td>\n<\/tr>\n | ||||||
68<\/td>\n | Q.14.9 Failure rate level determination Q.14.10 Outgoing quality level <\/td>\n<\/tr>\n | ||||||
69<\/td>\n | Annex X (informative)Cross-references to IEC 62391-1:2015 Table X.1 \u2013 Cross-references to the previous edition <\/td>\n<\/tr>\n | ||||||
70<\/td>\n | Bibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" Fixed electric double-layer capacitors for use in electric and electronic equipment – Generic specification<\/b><\/p>\n |