{"id":420111,"date":"2024-10-20T06:29:23","date_gmt":"2024-10-20T06:29:23","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bsi-pd-iec-ts-62647-222013-2\/"},"modified":"2024-10-26T12:08:05","modified_gmt":"2024-10-26T12:08:05","slug":"bsi-pd-iec-ts-62647-222013-2","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bsi-pd-iec-ts-62647-222013-2\/","title":{"rendered":"BSI PD IEC\/TS 62647-22:2013"},"content":{"rendered":"

This part of IEC 62647 is intended for use as technical guidance by aerospace, defence, and high performance (ADHP) electronic applications and systems suppliers, e.g., original equipment manufacturers (OEMs) and system maintenance facilities, in developing and implementing designs and processes to ensure the continued performance, quality, reliability, safety, airworthiness, configuration control, affordability, maintainability, and supportability of high performance aerospace systems (subsequently referred to as ADHP) both during and after the transition to Pb-free electronics.<\/p>\n

The guidelines may be used by the OEMs and maintenance facilities to implement the methodologies they use to ensure the performance, reliability, airworthiness, safety, and certifiability of their products, in accordance with IEC\/TS 62647-1:2012.<\/p>\n

This document also contains lessons learned from previous experience with Pb-free aerospace electronic systems. The lessons learned give specific references to solder alloys and other materials, and their expected applicability to various operating environmental conditions. The lessons learned are intended for guidance only; they are not guarantees of success in any given application.<\/p>\n

This document may be used by other high-performance and high-reliability industries, at their discretion.<\/p>\n

PDF Catalog<\/h4>\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n
PDF Pages<\/th>\nPDF Title<\/th>\n<\/tr>\n
4<\/td>\nCONTENTS <\/td>\n<\/tr>\n
7<\/td>\nFOREWORD <\/td>\n<\/tr>\n
9<\/td>\nINTRODUCTION <\/td>\n<\/tr>\n
11<\/td>\n1 Scope
2 Normative references <\/td>\n<\/tr>\n
12<\/td>\n3 Terms, definitions and abbreviations
3.1 Terms and definitions <\/td>\n<\/tr>\n
17<\/td>\n3.2 Abbreviations <\/td>\n<\/tr>\n
18<\/td>\n4 Approach
4.1 General
4.2 Assumption <\/td>\n<\/tr>\n
19<\/td>\n5 General Pb-free solder alloy behavior
5.1 General
5.2 Elevated temperature <\/td>\n<\/tr>\n
20<\/td>\n5.3 Low temperatures <\/td>\n<\/tr>\n
22<\/td>\n5.4 Temperature cycling
5.4.1 General <\/td>\n<\/tr>\n
23<\/td>\n5.4.2 Solder thermal cycling failure mode
5.4.3 Stress relaxation considerations
5.4.4 Ramp rate
5.4.5 Dwell time at elevated temperature <\/td>\n<\/tr>\n
24<\/td>\n5.4.6 Dwell time at low temperature
5.5 Rapid mechanical loading (vibration\/shock)
6 System level service environment
6.1 General <\/td>\n<\/tr>\n
25<\/td>\n6.2 Service environment
6.3 Electronics\/electrical equipment thermal environments
6.3.1 General
6.3.2 Electronics\/electrical equipment steady temperatures
6.3.3 Electronics\/electrical equipment temperature cycling
6.4 Vibration and shock <\/td>\n<\/tr>\n
26<\/td>\n6.5 Humidity
6.6 Other environments: salt spray, fungus, cooling air quality, and fluid compatibility
6.7 Other special requirements
7 High performance electronics testing <\/td>\n<\/tr>\n
27<\/td>\n8 Solder joint reliability considerations
8.1 General
8.1.1 Overview
8.1.2 Final solder joint composition
8.1.3 Solder wetting and final joint shape <\/td>\n<\/tr>\n
28<\/td>\n8.1.4 Strength of the PCB\/PWB and component interfaces
8.2 Mixing of solder alloys and finishes
8.3 Pb-free terminations in tin-lead joints
8.3.1 General <\/td>\n<\/tr>\n
29<\/td>\n8.3.2 Ball grid array Pb-free terminations in tin-lead joints <\/td>\n<\/tr>\n
31<\/td>\n8.3.3 Flat pack and chip device Pb-free terminations in tin-lead joints <\/td>\n<\/tr>\n
32<\/td>\n8.4 Tin-lead terminations in Pb-free joints
8.4.1 General
8.4.2 Ball grid array tin-lead terminations in lead-free joints
8.4.3 Flat pack and chip device tin-lead terminations in lead-free joints
8.5 Bismuth effects <\/td>\n<\/tr>\n
33<\/td>\n8.6 JCAA\/JG-PP testing of mixed alloy combinations
8.6.1 General
8.6.2 Vibration <\/td>\n<\/tr>\n
34<\/td>\n8.6.3 Thermal shock testing
8.6.4 Combined environments
8.7 Pb-free solder and mixed metallurgy modeling <\/td>\n<\/tr>\n
35<\/td>\nTables
Table 1 \u2013 Review of piece part surface finish and potential concerns <\/td>\n<\/tr>\n
36<\/td>\nTable 2 \u2013 Elements promoting and supressing tin whiskers <\/td>\n<\/tr>\n
37<\/td>\nTable 3 \u2013 Elements promoting and supressing tin pest <\/td>\n<\/tr>\n
38<\/td>\n9 Piece parts
9.1 Materials
9.2 Temperature rating
9.3 Special considerations
9.4 Plastic encapsulated microcircuit (PEM) moisture sensitivity level (MSL)
9.5 Terminal finish <\/td>\n<\/tr>\n
39<\/td>\nTable 4 \u2013 Piece part lead\/terminal and BGA ball metallization tin whisker and tin pest propensity <\/td>\n<\/tr>\n
40<\/td>\n9.6 Assembly stresses
9.7 Hot solder dipping
10 Printed circuit boards
10.1 General
10.2 Plated through holes <\/td>\n<\/tr>\n
41<\/td>\n10.3 Copper dissolution <\/td>\n<\/tr>\n
42<\/td>\n10.4 PCB\/PWB laminate materials
10.4.1 General
10.4.2 Coefficient of thermal expansion <\/td>\n<\/tr>\n
43<\/td>\n10.5 Surface finish <\/td>\n<\/tr>\n
44<\/td>\n10.6 Pb-free PCB\/PWB qualification
10.7 PCB\/PWB artwork and design considerations for Pb-free solder applications
Table 5 \u2013 PCB\/PWB metallization tin whisker and tin pest propensity <\/td>\n<\/tr>\n
45<\/td>\n11 Printed circuit board (PCB)\/printed wiring board (PWB) assembly
11.1 General
11.2 PCB\/PWB process indicator coupons
11.3 Solder inspection criterion
11.4 Fluxes, residues, cleaning and SIR issues <\/td>\n<\/tr>\n
46<\/td>\nTable 6 \u2013 Piece part terminal and BGA ball metallization solder process compatibility risk <\/td>\n<\/tr>\n
48<\/td>\n Table 7 \u2013 PCB\/PWB finish solder process compatibility risk <\/td>\n<\/tr>\n
49<\/td>\nTable 8 \u2013 Piece part terminal and BGA ball metallization reliability risk <\/td>\n<\/tr>\n
50<\/td>\nTable 9 \u2013 PCB\/PWB metallization reliability risk <\/td>\n<\/tr>\n
51<\/td>\n12 Module assembly considerations
12.1 Connectors and sockets
12.2 Heatsinks\/modules
12.3 Conformal coating <\/td>\n<\/tr>\n
52<\/td>\n13 Manufacturing resources
14 Aerospace wiring\/cabling considerations
14.1 Insulation temperature rating
14.2 Cable connectors
Table 10 \u2013 Relative rigidity of IPC-CC-830 conformal coating categories <\/td>\n<\/tr>\n
53<\/td>\n14.3 Wire terminals
14.4 Splices
14.5 Sleeving
15 Rework\/repair
15.1 General <\/td>\n<\/tr>\n
55<\/td>\n15.2 Piece part rework
15.2.1 Area array rework
15.2.2 Surface mount capacitor\/resistor rework
15.2.3 Through hole piece part rework <\/td>\n<\/tr>\n
56<\/td>\n15.3 Depot level repair
15.4 Mixed solder rework temperature profiles
15.5 Solder fluxes <\/td>\n<\/tr>\n
57<\/td>\n15.6 Rework\/repair cleaning process
15.7 Inspection requirements
16 Generic life testing
16.1 Thermal cycling, vibration, and shock testing
Table 11 \u2013 Process temperatures of mixed alloys <\/td>\n<\/tr>\n
58<\/td>\n16.2 Other environments
16.2.1 Salt fog
16.2.2 Cooling air quality
16.2.3 Fluid compatibility
16.2.4 Generic humidity
17 Similarity analysis <\/td>\n<\/tr>\n
60<\/td>\nAnnex A (informative) Equipment service environmental definition
A.1 Steady temperature service environments
A.2 Service cyclic temperature environments <\/td>\n<\/tr>\n
61<\/td>\nBibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":"

Process management for avionics. Aerospace and defence electronic systems containing lead-free solder – Technical guidelines<\/b><\/p>\n\n\n\n\n
Published By<\/td>\nPublication Date<\/td>\nNumber of Pages<\/td>\n<\/tr>\n
BSI<\/b><\/a><\/td>\n2013<\/td>\n74<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n","protected":false},"featured_media":420121,"template":"","meta":{"rank_math_lock_modified_date":false,"ep_exclude_from_search":false},"product_cat":[2641],"product_tag":[],"class_list":{"0":"post-420111","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-bsi","8":"first","9":"instock","10":"sold-individually","11":"shipping-taxable","12":"purchasable","13":"product-type-simple"},"_links":{"self":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product\/420111","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/types\/product"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media\/420121"}],"wp:attachment":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media?parent=420111"}],"wp:term":[{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_cat?post=420111"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_tag?post=420111"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}