This part of IEC 61249 gives requirements for properties of prepreg that is mainly intended to be used as bonding sheets in connection with laminates according to IEC 61249-2-39 when manufacturing multilayer boards according to IEC 62326-4. Multilayer boards comprised of these materials are suitable for lead-free assembly processes. This material may be also used to bond other types of laminates.<\/p>\n
Prepreg according to this standard is of defined flammability (vertical burning test). The flammability rating on fully cured prepreg is achieved through the use of brominated fire retardants contained as an integral part of the polymeric structure. After curing of the prepreg according to the supplier\u2019s instructions, the glass transition temperature is defined to be 170 \u00b0C minimum.<\/p>\n
| PDF Pages<\/th>\n | PDF Title<\/th>\n<\/tr>\n | ||||||
|---|---|---|---|---|---|---|---|
| 6<\/td>\n | English CONTENTS <\/td>\n<\/tr>\n | ||||||
| 8<\/td>\n | 1 Scope 2 Normative references 3 Materials and construction 3.1 General <\/td>\n<\/tr>\n | ||||||
| 9<\/td>\n | 3.2 Reinforcement 3.3 Resin system 4 Properties 4.1 Properties related to the appearance of the prepreg 4.1.1 General 4.1.2 Dewetted areas (fish eyes) 4.1.3 Broken filaments 4.1.4 Distortion 4.1.5 Creases <\/td>\n<\/tr>\n | ||||||
| 10<\/td>\n | 4.1.6 Edge conditions 4.2 Properties related to B-stage prepreg 4.2.1 General 4.2.2 Resin content 4.2.3 Treated weight 4.2.4 Resin flow <\/td>\n<\/tr>\n | ||||||
| 11<\/td>\n | 4.2.5 Scaled flow thickness 4.2.6 Melting viscosity 4.2.7 Gel time 4.2.8 Volatile content 4.3 Properties related to prepreg after curing 4.3.1 Electric strength 4.3.2 Flammability <\/td>\n<\/tr>\n | ||||||
| 12<\/td>\n | 4.3.3 Relative permittivity and dissipation factor 4.3.4 Cured thickness 4.3.5 Glass transition temperature (Tg) 4.3.6 Decomposition temperature (Td) 4.3.7 Time to delamination Tables Table 1 \u2013 Flammability, vertical burning test Table 2 \u2013 Decomposition temperature requirements <\/td>\n<\/tr>\n | ||||||
| 13<\/td>\n | 4.3.8 Z-axis expansion 5 Delivery form 5.1 General 5.2 Rolls 5.3 Sheets 5.4 Cut panels 6 Quality assurance 6.1 Quality system Table 3 \u2013 Time to delamination requirements Table 4 \u2013 Z-axis expansion requirements <\/td>\n<\/tr>\n | ||||||
| 14<\/td>\n | 6.2 Responsibility for inspection 6.3 Qualification inspection 6.4 Quality conformance inspection 6.5 Certificate of conformance 6.6 Safety data sheet 7 Packaging and marking <\/td>\n<\/tr>\n | ||||||
| 15<\/td>\n | 8 Shelf life 9 Ordering information <\/td>\n<\/tr>\n | ||||||
| 16<\/td>\n | Bibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" Materials for printed boards and other interconnecting structures – Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly<\/b><\/p>\n |