{"id":410569,"date":"2024-10-20T05:41:03","date_gmt":"2024-10-20T05:41:03","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bsi-22-30450737-dc-2022\/"},"modified":"2024-10-26T10:27:49","modified_gmt":"2024-10-26T10:27:49","slug":"bsi-22-30450737-dc-2022","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bsi-22-30450737-dc-2022\/","title":{"rendered":"BSI 22\/30450737 DC 2022"},"content":{"rendered":"
PDF Pages<\/th>\n | PDF Title<\/th>\n<\/tr>\n | ||||||
---|---|---|---|---|---|---|---|
1<\/td>\n | 30450737-NC.pdf <\/td>\n<\/tr>\n | ||||||
3<\/td>\n | ISO_DIS 9455-17 ed.2 – id.84464 Enquiry PDF (en).pdf <\/td>\n<\/tr>\n | ||||||
6<\/td>\n | Foreword <\/td>\n<\/tr>\n | ||||||
9<\/td>\n | 1 Scope 2 Normative references 3 Terms and definitions 4 Principle <\/td>\n<\/tr>\n | ||||||
10<\/td>\n | 5 Reagents 6 Apparatus <\/td>\n<\/tr>\n | ||||||
14<\/td>\n | 7 Inspection of test coupons 7.1 Surface plating 7.1.1 Slivering (thin metal overhang on etch runs) <\/td>\n<\/tr>\n | ||||||
15<\/td>\n | 7.1.2 Plating nodules 7.1.3 Plating pits 7.2 Surface laminate 8 Sample preparation 8.1 Preparation of the flux test solution 8.1.1 Liquid flux samples 8.1.2 Solid flux samples 8.1.3 Flux cored solder wire or preform samples <\/td>\n<\/tr>\n | ||||||
16<\/td>\n | 8.1.4 Solder paste samples 8.1.5 Paste flux samples 8.2 Preparation of the test coupons 8.2.1 Sample identification 8.2.2 Test coupons <\/td>\n<\/tr>\n | ||||||
17<\/td>\n | 8.2.3 Test coupon pre-cleaning 9 Procedure 9.1 Methods for connecting test coupons 9.1.1 Board circuitry layout <\/td>\n<\/tr>\n | ||||||
18<\/td>\n | 9.1.2 Preconditioning of SIR test coupons prior to processing (optional) <\/td>\n<\/tr>\n | ||||||
19<\/td>\n | 9.2 Fluxing and soldering test patterns 9.2.1 Liquid and solid flux samples and flux-cored solder wire samples 9.2.2 Soldering using wave solder system 9.2.3 Soldering using static solder pot <\/td>\n<\/tr>\n | ||||||
20<\/td>\n | 9.2.4 Solder paste samples 9.2.5 Paste flux samples 9.3 Cleaning <\/td>\n<\/tr>\n | ||||||
21<\/td>\n | 9.4 SIR measurement 9.4.1 High resistance measurement system verification 9.4.2 Test coupon measurements 9.5 Electrochemical migration test 10 Assessment <\/td>\n<\/tr>\n | ||||||
22<\/td>\n | 11 Precision 12 Test report <\/td>\n<\/tr>\n | ||||||
23<\/td>\n | Annex\u20acA (informative) SIR testing guidance <\/td>\n<\/tr>\n | ||||||
25<\/td>\n | Annex\u20acB (informative) Surface insulation resistance comb test and electrochemical migration test of flux residues\u20ac\u2014 Qualification test report <\/td>\n<\/tr>\n | ||||||
27<\/td>\n | Bibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" BS EN ISO 9455-17. Soft soldering fluxes. Test methods – Part 17. Surface insulation resistance comb test and electrochemical migration test of flux residues<\/b><\/p>\n |