{"id":276275,"date":"2024-10-19T18:35:40","date_gmt":"2024-10-19T18:35:40","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bs-en-iec-60749-202020\/"},"modified":"2024-10-25T15:01:59","modified_gmt":"2024-10-25T15:01:59","slug":"bs-en-iec-60749-202020","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bs-en-iec-60749-202020\/","title":{"rendered":"BS EN IEC 60749-20:2020"},"content":{"rendered":"

IEC 60749-20:2020 is available as IEC 60749-20:2020 RLV<\/span> which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 60749-20:2020 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive. This edition includes the following significant technical changes with respect to the previous edition: – incorporation of a technical corrigendum to IEC 60749-20:2008 (second edition ); – inclusion of new Clause 3; – inclusion of explanatory notes.<\/p>\n

PDF Catalog<\/h4>\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n
PDF Pages<\/th>\nPDF Title<\/th>\n<\/tr>\n
2<\/td>\nundefined <\/td>\n<\/tr>\n
5<\/td>\nAnnex ZA(normative)Normative references to international publicationswith their corresponding European publications <\/td>\n<\/tr>\n
6<\/td>\nEnglish
CONTENTS <\/td>\n<\/tr>\n
8<\/td>\nFOREWORD <\/td>\n<\/tr>\n
10<\/td>\n1 Scope
2 Normative references
3 Terms and definitions <\/td>\n<\/tr>\n
11<\/td>\n4 General description
5 Test apparatus and materials
5.1 Humidity chamber <\/td>\n<\/tr>\n
12<\/td>\n5.2 Reflow soldering apparatus
5.3 Holder
5.4 Wave-soldering apparatus
5.5 Solvent for vapour-phase reflow soldering
5.6 Flux
5.7 Solder
Figures
Figure 1 \u2013 Method of measuring the temperature profile of a specimen <\/td>\n<\/tr>\n
13<\/td>\n6 Procedure
6.1 Initial measurements
6.1.1 Visual inspection
6.1.2 Electrical measurement
6.1.3 Internal inspection by acoustic tomography
6.2 Drying
6.3 Moisture soak
6.3.1 General
6.3.2 Conditions for non-dry-packed SMDs
Tables
Table 1 \u2013 Moisture soak conditions for non-dry-packed SMDs <\/td>\n<\/tr>\n
14<\/td>\n6.3.3 Moisture soak for dry-packed SMDs
Table 2 \u2013 Moisture soak conditions for dry-packed SMDs (method A) <\/td>\n<\/tr>\n
15<\/td>\n6.4 Soldering heat
6.4.1 General
Table 3 \u2013 Moisture soak conditions for dry-packed SMDs (method B) <\/td>\n<\/tr>\n
16<\/td>\n6.4.2 Method of heating by infrared convection or convection reflow soldering
Table 4 \u2013 SnPb eutectic process \u2013 Classification reflow temperatures (Tc) <\/td>\n<\/tr>\n
17<\/td>\n6.4.3 Method of heating by vapour-phase reflow soldering
6.4.4 Method of heating by wave-soldering
Table 5 \u2013 Pb-free process \u2013 Classification reflow temperatures (Tc)
Table 6 \u2013 Heating condition for vapour-phase soldering <\/td>\n<\/tr>\n
18<\/td>\n6.5 Recovery
Figure 2 \u2013 Heating by wave-soldering
Table 7 \u2013 Immersion conditions for wave-soldering <\/td>\n<\/tr>\n
19<\/td>\n6.6 Final measurements
6.6.1 Visual inspection
6.6.2 Electrical measurement
6.6.3 Internal inspection by acoustic tomography
7 Information to be given in the relevant specification <\/td>\n<\/tr>\n
21<\/td>\nAnnex A (informative) Details and description of test method on resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
A.1 Description of moisture soak
A.1.1 Guidance for moisture soak
A.1.2 Considerations on which the condition of moisture soak is based <\/td>\n<\/tr>\n
22<\/td>\nFigure A.1 \u2013 Process of moisture diffusion at 85 \u00b0C, 85 % RH
Figure A.2 \u2013 Definition of resin thickness and the first interface
Figure A.3 \u2013 Moisture soak time to saturation at 85 \u00b0C as a function of resin thickness <\/td>\n<\/tr>\n
23<\/td>\nFigure A.4 \u2013 Temperature dependence of saturated moisture content of resin
Table A.1 \u2013 Comparison of actual storage conditions and equivalent moisture soak conditions before soldering heat <\/td>\n<\/tr>\n
24<\/td>\nFigure A.5 \u2013 Dependence of moisture content of resin at the first interface on resin thickness under various soak conditions
Figure A.6 \u2013 Dependence of moisture content of resin at the first interface on resin thickness related to method A of moisture soak <\/td>\n<\/tr>\n
25<\/td>\nFigure A.7 \u2013 Dependence of the moisture content of resin at the first interface on resin thickness related to method B of moisture soak <\/td>\n<\/tr>\n
26<\/td>\nA.2 Procedure for moisture content measurement
Figure A.8 \u2013 Dependence of moisture content of resin at the first interface on resin thickness related to condition B2 of method B of moisture soak <\/td>\n<\/tr>\n
27<\/td>\nA.3 Soldering heat methods
A.3.1 Temperature profile of infrared convection and convection reflow soldering
Figure A.9 \u2013 Temperature profile of infrared convection and convection reflow soldering for Sn-Pb eutectic assembly <\/td>\n<\/tr>\n
28<\/td>\nFigure A.10 \u2013 Temperature profile of infrared convection and convection reflow soldering for lead-free assembly
Table A.2 \u2013 Classification profiles <\/td>\n<\/tr>\n
29<\/td>\nA.3.2 Temperature profile of vapour-phase soldering
Figure A.11 \u2013 Classification profile
Figure A.12 \u2013 Temperature profile of vapour-phase soldering (condition II-A) <\/td>\n<\/tr>\n
30<\/td>\nA.3.3 Heating method by wave-soldering
Figure A.13 \u2013 Immersion method into solder bath <\/td>\n<\/tr>\n
31<\/td>\nFigure A.14 \u2013 Relation between the infrared convection reflow soldering and wave-soldering
Figure A.15 \u2013 Temperature in the body of the SMD during wave-soldering <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":"

Semiconductor devices. Mechanical and climatic test methods – Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat<\/b><\/p>\n\n\n\n\n
Published By<\/td>\nPublication Date<\/td>\nNumber of Pages<\/td>\n<\/tr>\n
BSI<\/b><\/a><\/td>\n2020<\/td>\n32<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n","protected":false},"featured_media":276278,"template":"","meta":{"rank_math_lock_modified_date":false,"ep_exclude_from_search":false},"product_cat":[573,2641],"product_tag":[],"class_list":{"0":"post-276275","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-31-080-01","7":"product_cat-bsi","9":"first","10":"instock","11":"sold-individually","12":"shipping-taxable","13":"purchasable","14":"product-type-simple"},"_links":{"self":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product\/276275","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/types\/product"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media\/276278"}],"wp:attachment":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media?parent=276275"}],"wp:term":[{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_cat?post=276275"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_tag?post=276275"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}