IEC 61760-2:2021

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Surface mounting technology – Part 2: Transportation and storage conditions of surface mounting devices (SMD) – Application guide

Published By	Publication Date	Number of Pages
IEC	2021-07-16	34

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Categories: 31.240 - Mechanical structures for electronic equipment, IEC

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Description

IEC 61760-2:2021 specifies the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled in order to enable trouble-free processing of surface mounting devices, both active and passive. (Conditions for printed boards are not taken into consideration.)
The object of this document is to ensure that users of SMDs receive and store products that can be further processed (e.g. positioned, soldered) without prejudice to quality and reliability. Improper transportation and storage of SMDs can cause deterioration and result in assembly problems such as poor solderability, delamination and "popcorning". Cross-references for references from this edition 3 to the previous edition 2 of this document are listed in Annex X of this document.

Additional information

Published Code	IEC
Published By	International Electrotechnical Commission
Publication Date	2021-07-16
Pages Count	34
Language	France
Edition	3.0
File Size	1.5 MB
ICS Codes	31.240 - Mechanical structures for electronic equipment

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IEC 61760-2:2021

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