DIN EN IEC 61189-5-501:2019 Edition

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Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 5-501: General test methods for materials and assemblies – Surface insulation resistance (SIR) testing of solder fluxes (Draft)

Published By	Publication Date	Number of Pages
DIN	2019-11	32

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Categories: 31.180 - Printed circuits and boards, DIN

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Description

This part of IEC 61189-5 is used to quantify the deleterious effects of flux residues on surface insulation resistance (SIR) in the presence of moisture. Interdigitated comb patterns comprising long parallel electrodes on an IPC B53 standardized test specimen shall be used for the evaluation. Specimens shall be conditioned and measurements taken at a high temperature and humidity. The electrodes are electrically biased during conditioning to facilitate electrochemical reactions.

Additional information

Published Code	DIN
Published By	Deutsches Institut für Normung
Publication Date	2019-11
Pages Count	32
Language	Germany
Descriptors	Assemblies, Condensation, Conductive, Conductivity, Corrosion tests, Determination, Electrical components, Electrical engineering, Electronic equipment and components, Fluxes (materials), Humidity, Humidity test, Insulating resistance, Interconnection structures, Materials, Measurement, Measuring techniques, Mechanical testing, Methods, Moisture, Precision, Printed circuits, Printed-circuit boards, Solderings, Specimen preparation, Surface insulation resistance, Testing, Testing conditions, Testing devices, Processes, Checking equipment, Procedures, Sample preparation
File Size	1.6 MB
ICS Codes	31.180 - Printed circuits and boards

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DIN EN IEC 61189-5-501:2019 Edition

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