BSI PD IEC TR 60890:2022
$198.66
A method of temperature-rise verification of low-voltage switchgear and controlgear assemblies by calculation
Published By | Publication Date | Number of Pages |
BSI | 2022 | 60 |
PDF Catalog
PDF Pages | PDF Title |
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2 | undefined |
4 | CONTENTS |
7 | FOREWORD |
9 | INTRODUCTION |
10 | 1 Scope 2 Normative references 3 Terms and definitions |
11 | 4 Verification conditions 5 Calculation method 5.1 Assumptions made in this calculation |
12 | 5.2 Necessary information 5.3 Calculation procedure 5.3.1 General 5.3.2 Determination of the effective cooling surface Ae of the enclosure 5.3.3 Determination of the internal temperature-rise Δt0,5 of the air at mid-height of the enclosure |
13 | 5.3.4 Determination of the internal temperature-rise Δt1,0 of air at the top of the enclosure 5.3.5 Characteristic curve for temperature-rise of air inside enclosure |
14 | Figures Figure 1 – Temperature-rise characteristic curve for enclosures with Ae exceeding 1,25 m2 |
15 | 5.4 Maximum internal air temperature limits 6 Further considerations 6.1 General 6.2 Guidance on the effects of an uneven power distribution Figure 2 – Temperature-rise characteristic curve for enclosures with Ae not exceeding 1,25 m2 |
16 | 6.3 Guidance on the additional temperature-rise effect due to solar radiation |
17 | 7 Evaluation of the design Tables Table 1 – Method of calculation, application, formulas and characteristics |
18 | Table 2 – Symbols, units and designations |
19 | Table 3 – Surface factor b according to the type of installation Table 4 – Factor d for enclosures without ventilation openings and with an effective cooling surface Ae > 1,25 m2 Table 5 – Factor d for enclosures with ventilation openings and an effective cooling surface Ae > 1,25 m2 |
20 | Figure 3 – Enclosure constant k for enclosures without ventilation openings, with an effective cooling surface Ae > 1,25 m2 Table 6 – Equation for Figure 3 |
21 | Figure 4 – Temperature distribution factor c for enclosures without ventilation openings and with an effective cooling surface Ae > 1,25 m2 Table 7 – Equations for Figure 4 |
22 | Figure 5 – Enclosure constant k for enclosures with ventilation openings and an effective cooling surface Ae > 1,25 m2 Table 8 – Equations for Figure 5 |
23 | Figure 6 – Temperature distribution factor c for enclosures with ventilation openings and an effective cooling surface Ae > 1,25 m2 |
24 | Figure 7 – Enclosure constant k for enclosures without ventilation openings and with an effective cooling surface Ae ≤ 1,25 m2 Table 9 – Equations for Figure 6 |
25 | Figure 8 – Temperature distribution factor c for enclosures without ventilation openings and with an effective cooling surface Ae ≤ 1,25 m2 Table 10 – Equation for Figure 7 |
26 | Table 11 – Equation for Figure 8 |
27 | Figure 9 – Calculation of temperature-rise of air inside enclosures |
28 | Annexes Annex A (informative) Examples for the calculation of the temperature-rise of air inside enclosures A.1 Example 1 Figure A.1 – Example 1, calculation for an enclosure with exposed side faces without ventilation openings and without internal horizontal partitions |
30 | Figure A.2 – Example 1, calculation for a single enclosure |
31 | A.2 Example 2 Figure A.3 – Example 2, calculation for an enclosure for wall-mounting with ventilation openings |
32 | Figure A.4 – Example 2, calculation for one enclosure half |
34 | Figure A.5 – Example 2, calculation for an enclosure for wall-mounting with ventilation openings |
35 | Annex B (informative) Guidance on the effects of an uneven power distribution B.1 Horizontal partition B.2 Calculation of internal air temperature-rise for assemblies with ventilation openings with even power distribution and less than 50 % perforation in horizontal partitions Figure B.1 – Examples of assemblies with horizontal partitions |
36 | B.3 Calculation of internal air temperature-rise with an uneven power distribution Figure B.2 – Temperature-rise verification of a higher-power circuit |
37 | Annex C (informative) Guidance on the additional temperature-rise effect due to solar radiation C.1 General C.2 Solar radiation phenomena Figure C.1 – Solar radiation phenomena |
38 | C.3 Solar radiation – consequences for thermal calculation Figure C.2 – Interpolation curve Table C.1 – Approximate solar absorption radiation coefficients (according to colour) |
39 | C.4 Solar radiation of enclosures with air ventilation openings |
40 | Annex D (informative) Guidance on the effect of different enclosure materials, construction and finishes D.1 General D.2 Validity criteria D.3 Material of enclosure D.4 Results |
41 | Figure D.1 – Results of comparison tests |
42 | Annex E (informative) Guidance on the effects of different natural ventilation arrangements Figure E.1 – Examples of crossing diagonal installation |
43 | Figure E.2 – Effect of additional filters |
44 | Annex F (informative) Guidance on forced ventilation management F.1 General F.2 Forced ventilation installation system F.3 Installation considerations |
45 | Figure F.1 – Examples of forced ventilation arrangements |
46 | Annex G (informative) Power loss values calculation G.1 General G.2 Power losses of low-voltage switchgear and controlgear G.3 Power losses of conductors connecting low-voltage switchgear and controlgear |
47 | G.4 Power losses of busbars G.5 Power losses of electronic devices |
48 | Annex H (informative) Guidance on the impact of an adjacent wallon the assembly cooling surfaces Figure H.1 – Wall-mounted assembly |
49 | Figure H.2 – Floor-standing assembly |
50 | Annex I (informative) Operating current and power loss of copper conductors |
51 | Table I.1 – Operating current and power loss of single-core copper cables with a permissible conductor temperature of 70 °C (ambient temperature insidethe enclosure: 55 °C) |
52 | Table I.2 – Reduction factor k1 for cables with a permissible conductor temperature of 70 °C (extract from IEC 60364-5-52:2009, Table B.52.14) |
53 | Table I.3 – Operating current and power loss of bare copper bars with rectangular cross-section, run horizontally and arranged with their largest face vertical, for DC and AC frequencies 16 2/3 Hz, 50 Hz to 60 Hz (ambient temperature inside the enclosure: 55 °C, temperature of the conductor 70 °C) |
54 | Table I.4 – Factor k4 for different temperatures ofthe air inside the enclosure and/or for the conductors |
55 | Annex J (informative) Guidance to magnetic and eddy-current power losses Figure J.1 – Power losses distribution for differentgland plates with the same rating |
56 | Annex K (informative) Forced ventilation airflow calculation K.1 General |
57 | K.2 Ventilation airflow calculation Table K.1 – Factor k for altitudes above sea level |
59 | Bibliography |