BS EN IEC 61189-2-804:2023

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Test methods for electrical materials, printed board and other interconnection structures and assemblies – Test methods for time to delamination. T260, T288, T300

Published By	Publication Date	Number of Pages
BSI	2023	14

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Description

This International Standard specifies a test method to determine the time to delamination of base materials and printed boards using a thermomechanical analyzer (TMA). Temperatures used for this evaluation are typically 260 °C, 288 °C and 300 ºC, but are not limited to these values.

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PDF Pages	PDF Title
2	undefined
5	Annex ZA (normative)Normative references to international publicationswith their corresponding European publications
6	English CONTENTS
7	FOREWORD
9	1 Scope 2 Normative references 3 Terms and definitions 4 Specimen preparation 5 Test specimens
10	6 Test equipment 7 Test procedure 8 Calculation
11	9 Report Figure 1 – A typical plot for an epoxy material at an isothermal temperature of 260 °C
12	Bibliography

Additional information

Status	Definitive
Pages	14
Publication Date	2023-12-25
ISBN	978 0 539 29807 9
Standard Number	BS EN IEC 61189-2-804:2023
Title	Test methods for electrical materials, printed board and other interconnection structures and assemblies – Test methods for time to delamination. T260, T288, T300
Identical National Standard Of	IEC 61189-2-804:2023, EN IEC 61189-2-804:2023
Corrects	BS IEC 61189-2-804:2023
Descriptors	Thermo-mechanical separation, Delamination, Printed-circuit boards, Electrically-conducting materials, Electrical equipment, Testing methods
Publisher	BSI
Committee	EPL/501
ICS Codes	31.180 - Printed circuits and boards

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BS EN IEC 61189-2-804:2023

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