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BS EN IEC 60747-16-8:2022:2023 Edition

BS EN IEC 60747-16-8:2022:2023 Edition

$167.15

Semiconductor devices – Microwave integrated circuits. Limiters

Published By Publication Date Number of Pages
BSI 2023 44
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This part of IEC 60747 specifies the terminology, essential ratings and characteristics, and measuring methods of microwave integrated circuit limiters.

PDF Catalog

PDF Pages PDF Title
2 undefined
7 Annex ZA (normative)Normative references to international publicationswith their corresponding European publications
9 English
CONTENTS
12 FOREWORD
14 1 Scope
2 Normative references
3 Terms and definitions
16 4 Essential ratings and characteristics
4.1 General requirements
4.1.1 Circuit identification and types
4.1.2 General function description
4.1.3 Manufacturing technology
4.1.4 Package identification
4.1.5 Main application
17 4.2 Application description
4.2.1 Conformance to system and/or interface information
4.2.2 Overall block diagram
4.2.3 Reference data
4.2.4 Electrical compatibility
4.2.5 Associated devices
4.3 Specification of the function
4.3.1 Detailed block diagram – Functional blocks
18 4.3.2 Identification and function of terminals
4.3.3 Function description
Tables
Table 1 – Function of terminals
19 4.4 Limiting values (absolute maximum rating system)
4.4.1 Requirements
4.4.2 Electrical limiting values
Table 2 – Electrical limiting values
20 4.4.3 Temperatures
4.5 Operating conditions (within the specified operating temperature range)
4.6 Electrical characteristics
Table 3 – Electrical limiting values in detail specification
Table 4 – Temperatures
21 4.7 Mechanical and environmental ratings, characteristics and data
4.8 Additional information
Table 5 – Electrical characteristics
22 5 Measuring methods
5.1 General
5.1.1 General precautions
5.1.2 Characteristic impedance
5.1.3 Handling precautions
5.1.4 Types
5.2 Insertion loss (Lins)
5.2.1 Purpose
5.2.2 Measuring methods
23 Figures
Figure 1 – Circuit diagram for the measurement of the insertion loss (method 1)
24 Figure 2 – Circuit diagram for the measurement of the scattering parameters
25 5.3 Input return loss (Lret(in))
5.3.1 Purpose
26 5.3.2 Measuring methods
Figure 3 – Circuit diagram for the measurement of the input return loss (method 1)
28 5.4 Output return loss (Lret(out))
5.4.1 Purpose
5.4.2 Measuring methods
29 Figure 4 – Circuit diagram for the measurement of the output return loss (method 1)
31 5.5 Input power at 1dB compression (Pi(1dB)) and output power at 1dB compression (Po(1dB))
5.5.1 Purpose
5.5.2 Circuit diagram
5.5.3 Principle of measurement
5.5.4 Circuit description and requirements
5.5.5 Precautions to be observed
5.5.6 Measurement procedure
32 5.5.7 Specified conditions
5.6 Intermodulation distortion (two-tone)(Pn/P1)
5.6.1 Purpose
5.6.2 Circuit diagram
Figure 5 – Circuit diagram for the measurement of intermodulation distortion
33 5.6.3 Principle of measurement
5.6.4 Circuit description and requirements
5.6.5 Precautions to be observed
34 5.6.6 Measurement procedure
5.6.7 Specified conditions
5.7 Power at the intercept point (for intermodulation products) (Pn(IP))
5.7.1 Purpose
5.7.2 Circuit diagram
5.7.3 Principle of measurement
5.7.4 Circuit description and requirements
5.7.5 Precautions to be observed
35 5.7.6 Measurement procedure
5.7.7 Specified conditions
5.8 Leakage power for continuous wave (Pleak(cw))
5.8.1 Purpose
5.8.2 Circuit diagram
36 5.8.3 Principle of measurement
5.8.4 Circuit description and requirements
5.8.5 Precautions to be observed
5.8.6 Measurement procedure
Figure 6 – Circuit diagram for the measurement of output leakage power
37 5.8.7 Specified conditions
5.9 Spike leakage power for pulse wave(Pleak(spike)) and flat leakage power for pulse wave (Pleak(flat))
5.9.1 Purpose
5.9.2 Circuit diagram
5.9.3 Principle of measurement
5.9.4 Circuit description and requirements
5.9.5 Precautions to be observed
5.9.6 Measurement procedure
38 5.9.7 Specified conditions
5.10 Response time(tres)
5.10.1 Purpose
5.10.2 Circuit diagram
5.10.3 Principle of measurement
Figure 7 – Circuit diagram for the measurement of response time
39 5.10.4 Circuit description and requirements
5.10.5 Precautions to be observed
5.10.6 Measurement procedure
Figure 8 – Spike leakage voltage and flat leakage voltage vs. time
40 5.10.7 Specified conditions
5.11 Recovery time(trec)
5.11.1 Purpose
5.11.2 Circuit diagram
5.11.3 Principle of measurement
Figure 9 – Circuit diagram for the measurement of recovery time
41 5.11.4 Circuit description and requirements
5.11.5 Precautions to be observed
5.11.6 Measurement procedure
Figure 10 – Pulse envelope and continuous wave envelope vs. Time
42 5.11.7 Specified conditions
43 Bibliography

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