BS EN 62047-14:2012
$102.76
Semiconductor devices. Micro-electromechanical devices – Forming limit measuring method of metallic film materials
| Published By | Publication Date | Number of Pages |
| BSI | 2012 | 22 |
IEC 62047-14:2012 describes definitions and procedures for measuring the forming limit of metallic film materials with a thickness range from 0,5 ?m to 300 ?m. The metallic film materials described herein are typically used in electric components, MEMS and micro-devices. When metallic film materials used in MEMS (see 2.1.2 of IEC 62047-1:2005) are fabricated by a forming process such as imprinting, it is necessary to predict the material failure in order to increase the reliability of the components. Through this prediction, the effectiveness of manufacturing MEMS components by a forming process can also be improved, because the period of developing a product can be reduced and manufacturing costs can thus be decreased. This standard presents one of the prediction methods for material failure in imprinting process.
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 6 | English CONTENTS |
| 7 | 1 Scope 2 Normative references 3 Terms, definitions and symbols 3.1 Terms and definitions |
| 8 | 3.2 Symbols 4 Testing method 4.1 General 4.2 Equipment Table 1 – List of letter symbols |
| 9 | 4.3 Specimen Figures Figure 1 – Equipment and tools for forming limit tests |
| 10 | 5 Test procedure and analysis 5.1 Test procedure Figure 2 – Rectangular specimens with six kinds of aspect ratio |
| 12 | 6 Test report |
| 13 | Annex A (informative) Principles of the forming limit diagram Figure A.1 – Forming limit diagram Figure A.2 – Hemispherical punch for forming limit measurement |
| 14 | Figure A.3 – Grid for forming limit measurement Figure A.4 – Loading path of the specimen with various aspect ratios |
| 15 | Annex B (informative) Grid marking method Figure B.1 – Procedure of a photographic grid marking method |
| 16 | Figure B.2 – Procedure for an inkjet grid marking method |
| 17 | Annex C (informative) Gripping method Figure C.1 – Gripping of the specimen using a ring shaped die |
| 18 | Figure C.2 – Gripping of the specimen using adhesive bonding |
| 19 | Annex D (informative) Strain measuring method Figure D.1 – Set up for strain measurement using digital camera Figure D.2 – Example of pixel converting image of deformed specimen |
