BS EN 61189-3:1997:2000 Edition
$198.66
Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Test methods for interconnection structures (printed boards)
| Published By | Publication Date | Number of Pages |
| BSI | 2000 | 62 |
| Publication Date | 2000-08-15 |
|---|---|
| Amends | BS EN 60601-2-34:2001 |
| Descriptors | Visual inspection (testing), Electronic equipment and components, Environmental testing, Printed circuits, Electrical insulating materials, Thermal testing, Test specimens, Specimen preparation, Temperature, Solderability testing, Peeling tests, Thermal-shock tests, Printed-circuit boards, Mechanical testing, Damp-heat tests, Accuracy, Test equipment, Adhesion tests, Reports, Precision, Humidity |
| Identical National Standard Of | IEC 61189-3:1997/AMD1:1999, EN 61189-3:1997/A1:1999 |
| Standard Number | BS EN 61189-3:1997, IEC 61189-3:1997 |
| ISBN | 0 580 27850 6 |
| Replaced By | BS EN 61189-3:2008 |
| Withdrawn Date | 2008-03-31 |
| Pages | 62 |
| Committee | EPL/501 |
| Publisher | BSI |
| Replaces | BS EN 60601-2-34:1995 |
| Title | Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Test methods for interconnection structures (printed boards) |
| Status | Withdrawn |
| ICS Codes | 31.190 - Electronic component assemblies |
