BS EN 60191-6-12:2002
$142.49
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Design guide for fine-pitch land grid array (FLGA). Rectangular type
| Published By | Publication Date | Number of Pages |
| BSI | 2002 | 24 |
Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is rectangular.
