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BS EN 62258-2:2011

BS EN 62258-2:2011

$215.11

Semiconductor die products – Exchange data formats

Published By Publication Date Number of Pages
BSI 2011 74
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IEC 62258-2:2011 specifies the data formats that may be used for the exchange of data which is covered by other parts of the IEC 62258 series, as well as definitions of all parameters used according to the principles and methods of IEC 61360. It introduces a Device Data Exchange (DDX) format, with the prime goal of facilitating the transfer of adequate geometric data between die manufacturer and CAD/CAE user and formal information models that allow data exchange in other formats such as STEP physical file format, in accordance with ISO 10303-21, and XML. The data format has been kept intentionally flexible to permit usage beyond this initial scope. It has been developed to facilitate the production, supply and use of semiconductor die products, including but not limited to wafers, singulated bare die, die and wafers with attached connection structures, minimally or partially encapsulated die and wafers. This standard reflects the DDX data format at version 1.3.0. With respect to the first edition, several parameters have been updated for this edition. This publication is to be read in conjunction with /2.

PDF Catalog

PDF Pages PDF Title
7 English
CONTENTS
10 INTRODUCTION
11 1 Scope and object
2 Normative references
12 3 Terms and definitions
4 Requirements
5 Device Data eXchange format (DDX) file goals and usage
6 DDX file format and file format rules
13 6.1 Data validity
6.2 Character set
6.3 SYNTAX RULES
14 7 DDX file content
7.1 DDX file content rules
16 7.2 DDX DEVICE block syntax
17 7.3 DDX data syntax
8 Definitions of DEVICE block parameters
18 8.1 BLOCK DATA
19 8.2 DEVICE DATA
22 8.3 GEOMETRIC DATA
23 Figures

Figure 1 – Relationship between geometric centre and geometric origin
27 8.4 TERMINAL DATA
28 Tables

Table 1 – Relationship between geometric centre and geometric origin
29 Table 2
Terminal shape co-ordinates
31 Table 3 – Terminal IO types
35 8.5 MATERIAL DATA
36 Table 4 – Substrate Connection Parameters
37 8.6 ELECTRICAL AND THERMAL RATING DATA
38 8.7 SIMULATION DATA
39 8.8 HANDLING, PACKING, STORAGE and ASSEMBLY DATA
40 8.9 WAFER SPECIFIC DATA
42 8.10 BUMP TERMINATION SPECIFIC DATA
44 8.11 MINIMALLY PACKAGED DEVICE (MPD) SPECIFIC DATA
45 8.12 QUALITY, RELIABILITY and TEST DATA
46 8.13 OTHER DATA
8.14 CONTROL DATA
50 Annex A (informative)
An example of a DDX DEVICE block
52 Annex B (informative)
Groups and Permutation
55 Annex C (informative)
A Typical CAD view from the DDX file block example given in Annex A
Figure C.1 – CAD representation of DDX example from Annex A
56 Annex D (informative)
Properties for Simulation
58 Annex E (informative)
TERMINAL and TERMINAL_TYPE graphical usage for CAD/CAM systems
59 Figure E.1 – Highlighting the MX and MY orientation properties
60 Figure E.2 – Highlighting the angular rotational orientation properties
61 Annex F (informative)
Cross-reference with IEC 61360-4
Table F.1 – Parameter List
64 Annex G (informative)
Notes on VERSION and NAME parameters
65 Annex H (informative)
Notes on WAFER parameters
66 Figure H.1 – Illustrating the WAFER parameters
67 Annex I (informative)
Additional notes
68 Annex J (informative)
DDX Version history
Table J.1 – Parameter Change History List
71 Annex K (informative)
Parse Control

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BS EN 62258-2:2011
$215.11