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BS EN 60749-43:2017

BS EN 60749-43:2017

$167.15

Semiconductor devices – Mechanical and climatic test methods – Guidelines for IC reliability qualification plans

Published By Publication Date Number of Pages
BSI 2017 44
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IEC 60749-43:2017 gives guidelines for reliability qualification plans of semiconductor integrated circuit products (ICs). This document is not intended for military- and space-related applications.

PDF Catalog

PDF Pages PDF Title
2 undefined
7 English
CONTENTS
9 FOREWORD
11 INTRODUCTION
12 1 Scope
2 Normative references
13 3 Terms and definitions
4 Product categories and applications
14 5 Failure
5.1 Failure distribution
Tables
Table 1 ā€“ Examples of product categories
15 5.2 Early failure
5.2.1 Description
Figures
Figure 1 ā€“ Bathtub curve
16 5.2.2 Early failure rate
Figure 2 ā€“ Failure process of IC manufacturing lots during the early failure period
17 Figure 3 ā€“ Weibull conceptual diagram of the early failure rate
19 5.2.3 Screening
Figure 4 ā€“ Example of a failure ratio: Ī± (in hundreds) and the number of failures for CL of 60 %
20 Figure 5 ā€“ Screening and estimated early fail rate in Weibull diagram
21 Figure 6 ā€“ Bathtub curve setting the point immediately after production as the origin
22 5.3 Random failure
5.3.1 Description
5.3.2 Mean failure rate
Figure 7 ā€“ Bathtub curve setting the point after screening as the origin
23 Figure 8 ā€“ Conceptual diagram of calculation method for the mean failure rate from the exponential distribution
24 Figure 9 ā€“ Conceptual diagram of calculation method for the mean failure rate as an extension of early failure
25 5.4 Wear-out failure
5.4.1 Description
5.4.2 Wear-out failure rate
26 Figure 10 ā€“ Conceptual diagram of the wear-out failure
Figure 11 ā€“ Conceptual diagram describing the concept of the acceleration test
28 6 Reliability test
6.1 Reliability test description
6.2 Reliability test plan
6.2.1 Procedures for creating a reliability test plan
30 Figure 12 ā€“ Concept of the reliability test in a Weibull diagram (based on sample size)
Table 2 ā€“ Cumulative failure probability 0,1 % over 10 years [Ɨ10ā€“6] for the third, fifth and seventh years
31 6.2.2 Estimation of the test time required to confirm the TDDB from the number of test samples
32 6.2.3 Estimation of the number of samples required to confirm the TDDB from the test time
33 6.3 Reliability test methods
Figure 13 ā€“ Concept of the reliability test in a Weibull diagram (based on test time)
34 Figure 14 ā€“ Difference in sampling sizes according tothe m value (image)
35 Table 3 ā€“ Major reliability (life) test methods and purposes
36 6.4 Acceleration models for reliability tests
6.4.1 Arrhenius model
Table 4 ā€“ Examples of the number of test samples and the test time in typical reliability (life) test methods
37 6.4.2 V-model:
6.4.3 Absolute water vapor pressure model
6.4.4 Coffin-Manson model
7 Stress test methods
38 8 Supplementary tests
Table 5 ā€“ LTPD sampling table for acceptance number Ac = 0
Table 6 ā€“ Major reliability (strength) test methods and purposes
39 9 Summary table of assumptions
Table 7 ā€“ Supplementary tests
40 Table 8 ā€“ Accelerating factors, calculation formulae and numerical valuesa
41 10 Summary
42 Bibliography

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BS EN 60749-43:2017
$167.15