Shopping Cart

No products in the cart.

ASTM-F459 2018

$40.63

F459-13(2018) Standard Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds

Published By Publication Date Number of Pages
ASTM 2018 5
Guaranteed Safe Checkout
Categories: ,

If you have any questions, feel free to reach out to our online customer service team by clicking on the bottom right corner. We’re here to assist you 24/7.
Email:[email protected]

ASTM F459-13-Reapproved2018

Withdrawn Standard: Standard Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds (Withdrawn 2023)

ASTM F459

Scope

1.1 These test methods cover tests to determine the pull strength of a series of wire bonds. Instructions are provided to modify the methods for use as a referee method. The methods can be used for wire bonds made with wire having a diameter of from 0.0007 to 0.003 in. (18 to 76 μm).

Note 1: Common usage at the present time considers the term “wire bond” to include the entire interconnection: both welds and the intervening wire span.

1.2 These test methods can be used only when the loop height of the wire bond is large enough to allow a suitable hook for pulling (see Fig. 1) to be placed under the wire.

FIG. 1 Suggested Configuration for a Pulling Hook

1.3 The precision of these methods has been evaluated for aluminum ultra-sonic wedge bonds; however, these methods can be used for gold and copper wedge or ball bonds.2

1.4 These methods are destructive. They are appropriate for use in process development or, with a proper sampling plan, for process control or quality assurance.

1.5 A nondestructive procedure is described in Practice F458.

1.6 The values in SI units are to be regarded as standard.

1.7 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior to use.

1.8 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.

Keywords

microelectronic wire bonds; pull strength; wire bonds;

ICS Code

ICS Number Code 29.120.20 (Connecting devices)

DOI: 10.1520/F0459-13R18

ASTM-F459 2018
$40.63